PCB manufacturing, Surface Mount and Through Hole soldering capabilities

What can we do for you? At NOTE Prototyping, our PCB assembly capabilities are built for speed, precision, and flexibility: ideal for prototyping, New Product Introduction (NPI), and low-volume production. From advanced SMT assembly to manual soldering and inspection, we support every step of your electronics development process with high-quality, fast-turnaround solutions.

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Our PCB, SMT and THT Capabilities

We support both Through Hole (THT) and Surface Mount (SMT) mixed assembly

Basic PCB Specifications

Feature

Capability

Size

Minimum	6mm x 6mm
Maximum	400mm x 400mm

Number of Layers

1 / 2 / 4 / 6 / 8 / 10 / 12 / 14 / 16 / 18 / 20

Material

FR-4 Tg 140C

Finish

ENIG-RoHS

PCB Thickness

1 Layer	-	-	0.8mm	1.0mm	1.2mm	1.6mm	2.0mm	-
2 Layers	0.4mm	0.6mm	0.8mm	1.0mm	1.2mm	1.6mm	2.0mm	-
4 Layers	-	-	0.8mm	1.0mm	1.2mm	1.6mm	2.0mm	-
6 Layers	-	-	0.8mm	1.0mm	1.2mm	1.6mm	2.0mm	-
8 Layers	-	-	0.8mm	1.0mm	1.2mm	1.6mm	2.0mm	-
10 Layers	-	-	-	1.0mm	1.2mm	1.6mm	2.0mm	-
12 Layers	-	-	-	-	1.2mm	1.6mm	2.0mm	2.5mm
14 Layers	-	-	-	-	-	1.6mm	2.0mm	2.5mm
16 Layers	-	-	-	-	-	1.6mm	2.0mm	2.5mm
18 Layers	-	-	-	-	-	-	2.0mm	2.5mm
20 Layers	-	-	-	-	-	-	2.0mm	2.5mm

Resist Colour

Green / Red / Yellow / Blue / White / Black / Purple -- LPI (Liquid Photo Imageable)

Copper Weight

2 / 4 / 6 Layers	1oz (35µm)	2oz (70µm) -- PCB thickness must be 1.6mm or 2mm if 2 layers
1 / 8+ Layers	1oz (35µm)	-

Gold Fingers

Supported if PCB bigger than 51mm x 51mm

Castellated Holes

Currently supported for panels

Advanced PCB Specifications

Feature

Capability

Description / Notes

Stack-Up

Default layer stack-up

Available on request

Dimensions Tolerance

CNC Routing	±0.2mm
V-Scoring	±0.4mm

Thickness Tolerance (PCB ≥ 1.0mm)

±10%

Thickness Tolerance (PCB < 1.0mm)

±0.1mm

Finished Inner Layer Copper

0.5oz (17.5µm)

Customer-Supplied PCBs / Panels Restrictions

Feature	Minimum	Maximum
Size	51mm x 51mm	400mm x 400mm
Thickness	0.8mm	3.2mm
Borders or No Components to Edge	10mm	-
Parallel and Symmetrical Edges	2	-

• NOTE Prototyping will not be responsible for any incompatibilities of the PCB finish with the assembly technology (example: HASL for fine pitch or BGA), impacting the quality of the assembly.
• Failure to comply with these constraints may require the production of tools, which will be billed to you directly and the cost of which will be specified to you upon receipt of your PCB.

Drill / Hole Size

Feature

Capability

Description / Notes

Drill Hole Size

Minimum	0.20mm
Maximum	6.30mm

Drill Hole Size Tolerance

+0.13mm
-0.08mm

Blind / Buried Vias

Not supported

Minimum Via Hole Size

1 / 2 Layers	0.3mm
4+ Layers	0.2mm

Minimum Via Diameter

1 / 2 Layers	0.6mm
4+ Layers	0.4mm

Plated Through Hole (PTH) Size

Minimum	0.20mm
Maximum	6.35mm

The annular ring size will be enlarged 0.15mm in production

Pad Size

Minimum	0.70mm
Maximum	6.35mm

The pad hole size will be enlarged 0.15mm in production

Minimum Non-Plated Through Holes (NPTH)

0.50mm

Please add NPTH to the mechanical layer or keep out layer

Minimum Plated Slot Width

0.65mm

Minimum Non-Plated Slot Width

1.0mm

Please draw the slot outline in the mechanical layer or keep out layer

Minimum Castellated Holes

0.60mm

A castellated pad includes a plated half-hole on the edge of a board, usually used on daughter PCB modules to solder to carrier boards.
• Hole diameter ≥ 0.6 mm
• Hole to board edge ≥ 1 mm
• Minimum board size 10 × 10 mm

Panelised castellated holes board

Panelise with stamp holes and add tooling strips on four board edges

The distance between castellated hole and board corner should be larger than 2mm.
Recommended diameter of stamp hole is 0.5mm-0.8mm;
Recommended distance between the two stamp holes is 0.2-0.3mm

Hole size Tolerance (Plated)

+0.13mm
-0.08mm

Hole size Tolerance (Non-Plated)

±0.2mm

Rectangular Hole/Slot

Not supported

Any rectangular holes or slots will be made round or oval

Minimum Annular Ring

Copper Weight	Minimum Annular Ring	Plated Through Hole (PTH)
1oz	0.13mm	0.3mm
2oz	0.2mm	0.3mm

Minimum Clearance

Features	Capabilities
Hole to Hole Clearance (Different Nets)	0.5mm
Via to Via Clearance (Same Nets)	0.254mm
Pad to Pad Clearance (Pad without Hole, Different Nets)	0.127mm
Pad to Pad Clearance (Pad with Hole, Different Nets)	0.5mm
Via to Track	0.254mm
Plated Through Hole (PTH) to Track	0.33mm
Non-Plated Through Hole (NPTH) to Track	0.254mm
Pad to Track	0.2mm

Minimum Trace Width and Spacing

	Minimum Trace Width / Minimum Spacing
1 / 2 Layers	5mil (0.127mm)
4+ Layers	3.5mil (0.09mm)
2oz Copper Weight	8mil (0.2mm)

BGA

Layer Count	Minimum BGA Pad Dimensions	Minimum Distance Between BGA
1 / 2 Layers	0.4mm	0.127mm
4+ Layers	0.25mm	0.127mm

Solder Mask

Feature

Capability

Description / Notes

Solder Mask Opening / Expansion

0.05mm

Minimum growth/mask opening around the pad to allow for any mis-registration

Minimum Distance between Pads to Apply Solder Mask Dam

Green	0.2mm (8mils)
Other Colours	0.254mm (10mils)

Solder Mask Dielectric Constant

3.8

Solder Mask Thickness

10-15µm

Legend

Feature	Capability	Description / Notes
Minimum Line Width	6mil (0.153mm)	Characters width less than 6mil (0.153mm) will be unidentifiable
Minimum Text Height	40mil (1.0mm)	Characters height less than 40mil (1.0mm) will be unidentifiable
Character Width to Height Ratio	1:6	Optimal
Pad To Silkscreen Minimum Distance	0.15mm	-

Board Outlines

Feature	Minimum
Trace to Outline	0.2mm
Trace to V-Cut Line	0.4mm